Products

One-part epoxy underfill with excellent thermal performance

One-part, capillary-flow epoxy underfill for high volume operations

Halogen free, low viscosity, reworkable underfill 

Bio-based hot melt adhesive for consumer electronics assembly

1-part hot melt adhesive for robot dispensing

High performance dispensable liquid with low outgassing

For silicone sensitive applications

High viscosity, halogen-free fine-particle ink for fine line printing

Conductive carbon ink with good abrasion resistance